- All sections
- B - Performing operations; transporting
- B24B - Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents
- B24B 37/005 - Control means for lapping machines or devices
Patent holdings for IPC class B24B 37/005
Total number of patents in this class: 562
10-year publication summary
|
50
|
49
|
34
|
41
|
52
|
67
|
63
|
70
|
59
|
22
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ebara Corporation | 1951 |
154 |
| Applied Materials, Inc. | 16587 |
118 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
52 |
| Sumco Corporation | 1116 |
21 |
| Shin-Etsu Handotai Co., Ltd. | 1277 |
17 |
| Samsung Electronics Co., Ltd. | 131630 |
10 |
| Tokyo Electron Limited | 11599 |
9 |
| Seagate Technology LLC | 4228 |
7 |
| Fujikoshi Machinery Corp. | 54 |
7 |
| Kioxia Corporation | 9847 |
7 |
| Illinois Tool Works Inc. | 11152 |
5 |
| Disco Corporation | 1745 |
5 |
| Axus Technology, LLC | 30 |
4 |
| Globalwafers Co., Ltd. | 561 |
4 |
| K.C. Tech Co., Ltd. | 78 |
4 |
| Rohm and Haas Electronic Materials CMP Holdings, Inc. | 309 |
4 |
| Changxin Memory Technologies, Inc. | 4732 |
4 |
| JPMorgan Chase Bank, National Association | 10964 |
3 |
| Cabot Microelectronics Corporation | 219 |
3 |
| II-VI Delaware, Inc. | 1720 |
3 |
| Other owners | 121 |